Endfire microphone array based on XMOS DSP and invensense MEMS

  • Intern
  • Engineer – Software
  • Izegem , Belgium
  • Televic Conference
  • 0319-177

Televic Conference offers state of the art wired and wireless discussion systems, applications for simultaneous translation and electronic voting systems. The conference products are characterized by an impeccable audio quality enabling high intelligibility of speeches during the meeting. Traditionally the units are equipped with a removable gooseneck microphone with screw lock connector. Its unidirectional response results in optimal performance even in environments with a lot of ambient noise. The gooseneck design also allows for a large freedom of movement. Another important advantage is the very low susceptibility to interference from mobile phones. A light ring indicates whether the microphone is switched off or on.

Although the gooseneck microphone is perfect from an audio quality point of view, we often get the feedback from users to reduce or even eliminate the visible part of the microphone as much as possible. While keeping the same user experience and supreme audio quality.

Observing recent technology evolutions it seems feasible to design and implement a low profile microphone suitable for conferencing.

The aim of this project is to investigate the possibilities of an XMOS DSP based microphone array. More specifically, it should be investigated if it is possible to make and endfire microphone array based on XMOS high-performance digital signal processing solutions together with high performance MEMS like TDK's invensense.

The final deliverable of the project is a working mockup of an endfire microphone array (connected with a conference unit provided by Televic Conference)

The work would consist out of:

  • making overview of requirements
  • theoretical study of endfire microphone arrays
  • evaluate and test XMOS demo board
  • prepare mockup:
  • XMOS
  • invensense MEMS line array
  • Mockup testing

For this project assistance will be foreseen by Televic Conference on the following knowledge area's:

  • Acoustics
  • Electronic design
  • Mechanical design

 

Nature of the work

  • Level: Master
  • Specialty: Electronics/Hardware
  • Expected outcome: Research: 30%, Implem. 35%, Experim. 35%
  • Location: Televic
  • Type: Measurement, Simulation, Implementation, Experimenting, Literature Study
  • Number of students: 1 

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